ECE4831 · Monash University
Microsystem packaging, assembly and testing
- Credit points
- 6
- Level
- 4
- Workload
- ≈ 12 h / week
- Faculty
- Engineering
What it covers
This unit cover all kinds of packaging from traditional techniques such as leaded and leadless packages, surface mount technology (SMT), and ball grid array (BGA) to advanced packaging techniques including: 2.5D and 3D packaging, Optoelectronics packaging, MEMS and Sensors packaging, Memory packaging. You will also explore practical and theoretical aspects in wire bonding, die bonding, wafer bonding, dicing, assembly. You will also be exposed to detailed concepts related to reliability study, electric shielding, electrostatic discharge, thermal management, failure analysis due to environmental conditions.
Assessment
| Task | Type | Weight |
|---|---|---|
| Assignments | Project | 20% |
| Tests and quizzes | Examination | 10% |
| Lab and presentation | Demonstration | 20% |
| Final examination | Examination | 50% |
When and where
| Teaching period | Campus | Mode |
|---|---|---|
| First semester | Malaysia | On-campus |