Microsystems and semiconductor fabrication

What it covers

The unit addresses the foundation and practical aspects of semiconductor devices, micro sensors, micro actuators and related microtechnologies. Topics include an in-depth exploration of principles and materials relevant to MEMS and semiconductor devices, electrical and mechanical characterisation, foundational MEMS structures such as cantilever beams, comb structures and semiconductor device patterns for diodes, transistors and CMOS integrated circuits. Microfabrication techniques for semiconductor and MEMS devices, such as photolithography, etching deposition and other essential techniques are covered. Furthermore, the unit encompasses characterisation techniques for mechanical and electrical studies, assembly, packaging, testing, reliability and environmental impact studies. It involves hands-on laboratory exercises, project work, computer-based simulation and the construction of semiconductor/MEMS devices for potential real-world applications.

Assessment

Hurdle tasks must be passed regardless of your overall mark.

When and where